ARATHANE 7762-1
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Controlled 5 mil Bondline
- Two-Hour Working Life
- Automated Non-Slump Dispensing
Product Description
ARATHANE 7762-1 Thermal Transfer Adhesive is a pink, one-component polyurethane paste for thermally conductive attachment of components on printed wiring boards. A controlled 5 mil bondline supports repeatable assembly of flat packs, PLCCs, and other devices where adhesive thickness affects placement and heat transfer. Its thixotropic, non-slump consistency enables automatic dispensing, while a working life of at least two hours at 23 deg C supports production use. After cure, the adhesive provides 0.80 W/m-K thermal conductivity, 600 to 660 V/mil dielectric strength, and substrate-specific lap-shear performance. The 100% solids, solvent-free formulation also supports bonding, filleting, and component protection.
Key Features
- Controlled 5 mil bondline: Supports repeatable component placement and adhesive thickness.
- Two-hour working life: Provides at least two hours of working time at 23 deg C.
- Automated non-slump dispensing: Thixotropic rheology supports controlled, reduced-handling application.
Applications
Bonding, filleting, and protection of flat packs, PLCCs, and other components on printed wiring boards.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
One-component adhesive values; storage and test conditions are shown with each property.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Pink paste | - | Visual |
| Density | 2.0 to 2.3 | g/cm3 | ASTM D-792 |
| Viscosity | 300,000 to 500,000 | cP | ASTM D-2393 at 25 deg C |
| Flash point | >94 | deg C | ASTM D93 |
| Solids | 100 | % | ASTM D2369 |
| Working life | >=2 | h | 23 deg C |
| Shelf life | 3 | months | Sealed original container below -40 deg C; from shipment |
After-processing / final-state properties
Cured-material values; mechanical results apply only to the stated ASTM D1002 substrates and conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 65 to 90 | Shore A | Typical cured value |
| Glass-transition temperature | -63 | deg C | ISO 11359 |
| Thermal conductivity | 0.80 | W/m-K | ISO 8894/90 |
| Dielectric strength | 600 to 660 | V/mil | IEC 60243 |
| Volume resistivity | 2.9 x 10^14 | ohm-cm | IEC 60093 |
| Lap-shear strength | 270 | psi | ASTM D1002 at 25 deg C; aluminum |
| Lap-shear strength | 300 | psi | ASTM D1002 at 25 deg C; Ajax-scrubbed nickel plate |
| Outgassing | TML 0.28; CVCM 0.03 | % | ASTM E595 at 10^-6 Torr |
